H.R. 6275 — China AI Power Report Act

This section expresses the sense of Congress that export controls on artificial intelligence technologies and related capabilities must be dynamic and adaptive to address evolving national security challenges from China; that such controls should be regularly updated to reflect technological innovations, China's advancing capabilities, and methods of diversion or circumvention; and that Congress must be fully informed of China's current and projected artificial intelligence capabilities to enable oversight and updates to export control authorities.

This section requires the Secretary of Commerce, in consultation with covered agency heads, to submit to the House Committee on Foreign Affairs and the Senate Committee on Banking, Housing, and Urban Affairs a report on China's advanced artificial intelligence (AI) capabilities, including supply chains for advanced AI systems—not later than 180 days after enactment of this Act and annually thereafter for three years. The report must assess (1) integrated circuits designed or optimized for advanced AI training or inference by leading Chinese AI chip designers, including Huawei Technologies Co., Ltd. and Cambricon Technologies (covering technical specifications such as total processing power, operations per second, memory capacity and bandwidth, power efficiency, process node, production volumes, foundries used, software ecosystem, international usage, and software layers for model translation); (2) leading Chinese semiconductor fabrication facilities producing logic integrated circuits for advanced AI training or inference, including those owned or operated by Semiconductor Manufacturing International Corporation (covering monthly production capacity per advanced process node of 16/14 nm and below, yields, most advanced process node, manufacturing equipment and its origins/export controls, collaborations, indigenization of controlled technologies, market share, and five-year trends); (3) leading Chinese facilities producing memory integrated circuits for advanced AI training or inference, including those owned or operated by ChangXin Memory Technologies or Yangtze Memory Technologies Corp. (covering high-bandwidth memory generations and specs, dynamic random-access memory half-pitch and capacity, three-dimensional NAND layers, yields and production capacity, manufacturing equipment and origins/export controls, collaborations, indigenization, market share, and five-year trends); and (4) leading semiconductor manufacturing facilities in China.